HOME> Regarding Harvatek> Factory Tour

 

 

 

Company introduction
Future view
Research and Development
Quality policy
Factory Tour

 

 



 

 

Testing and Typing

 

 

By automatic die bonding machine, we can keep the die position with high accuracy.

To ensure the die bonding quality, it is a must to perform die shear strength test for every lot.

 

 

 

By automatic wire bonding machine, we reduce the manpower necessary and still keep the wire bonding with high quality.

To ensure the bonding quality, we perform wire pull strength test for every lot.

 

Testing and Typing

 

 

 

 

Harvatek developed the LED-sorting program.


Every piece of LED will be tested with Iv, wavelength, forward voltage, and other characters. In general the binning condition is based on 20mA for testing, and the condition can be revised if customers specified.

 

 

 

 


High-speed automatic taping machines can not only get high quantities, but also keep high quality.

 

 

 

2007@ HARVATEK INC. All rights reserved. Site creation and technology by YTEC.